Packaging Engineer Job at ForwardEdge ASIC (a Lockheed Martin Company)
ForwardEdge ASIC (a Lockheed Martin Company) Minneapolis, MN
ForwardEdge ASIC, a Lockheed Martin company is enhancing Lockheed Martin’s domestic ASIC capabilities for our commercial, defense, and security customers, by delivering relevant, innovative and affordable microelectronics solutions.
Come be part of a culture that inspires employees to think big, perform with excellence and build incredible products! We provide the resources, inspiration, and focus. If you have the passion and courage to dream big, we want to build a better tomorrow with you.
We are seeking talented Package Design Engineers ranging from entry level associates to senior level principals. Qualifications and desired experience may include the following:
Clearance: These positions require eligibility for a government security clearance.
Work schedules: Flexible 9/80 Work schedules with every other Friday off.
Ability to Work Remotely: Onsite Full-time, with potential hybrid opportunity
Additional Information: Candidates may be eligible for short & long-term incentives. ForwardEdge ASIC offers a competitive benefit package to include options for healthcare and medical coverage, 401K Retirement Benefits with company contribution, as well as a generous holiday/PTO schedule. We also offer a comprehensive Employee Assistance Program for you and your family.
Come be part of a culture that inspires employees to think big, perform with excellence and build incredible products! We provide the resources, inspiration, and focus. If you have the passion and courage to dream big, we want to build a better tomorrow with you.
We are seeking talented Package Design Engineers ranging from entry level associates to senior level principals. Qualifications and desired experience may include the following:
- BS in Electrical Engineering, Computer Engineering, or related fields
- Eligibility for DoD Secret Clearance
- Appropriate-level experience, knowledge, and scope of responsibility over all aspects of IC package solutions. May include the following areas:
- Design and develop package solutions for IC products from design through to volume production, considering electrical, thermal, and mechanical requirements.
- Handle all aspects of package design/layout based on I/O constraints and form factor requirements, including routing, design for reliability, thermal, mechanical, manufacturability, bumping, substrate, material selection, assembly, and support for testing
- Drive IC packaging design and manufacturing from NPI to volume production
- Work with cross-functional ASIC teams and support package integration and architecture efforts with vendors
- Meet design specifications for high-speed interfaces such as HBM, DDR, PCIE and 56G/112G SerDes
- Knowledge of package design tools, simulation software, and analysis techniques.
- Experience in substrate layout of wire bond and flip chip packages
- Knowledge of high-speed design signal integrity practices
- Understanding of package design, roadmaps, and manufacturing
- Understanding of packaging materials, thermal management, and electrical interconnects
- Experience using Valor is helpful
Clearance: These positions require eligibility for a government security clearance.
Work schedules: Flexible 9/80 Work schedules with every other Friday off.
Ability to Work Remotely: Onsite Full-time, with potential hybrid opportunity
Additional Information: Candidates may be eligible for short & long-term incentives. ForwardEdge ASIC offers a competitive benefit package to include options for healthcare and medical coverage, 401K Retirement Benefits with company contribution, as well as a generous holiday/PTO schedule. We also offer a comprehensive Employee Assistance Program for you and your family.
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